CMUSH2-4
CMUSH2-4A
CMUSH2-4C
CMUSH2-4S
SURFACE MOUNT SILICON
SCHOTTKY DIODES
w w w. c e n t r a l s e m i . c o m
DESCRIPTION:
The CENTRAL SEMICONDUCTOR CMUSH2-4 series
devices are silicon Schottky diodes, epoxy molded in
a SOT-523 surface mount package, designed for fast
switching applications requiring a low forward voltage
drop.
SOT-523 CASE
CMUSH2-4:
CMUSH2-4A:
CMUSH2-4C:
CMUSH2-4S:
SINGLE
DUAL, COMMON ANODE
DUAL, COMMON CATHODE
DUAL, IN SERIES
MAXIMUM RATINGS: (TA=25°C)
Peak Repetitive Reverse Voltage
Continuous Forward Current
Peak Repetitive Forward Current
Peak Forward Surge Current, tp=10ms
Power Dissipation
Operating and Storage Junction Temperature
Thermal Resistance
MARKING
MARKING
MARKING
MARKING
CODE:
CODE:
CODE:
CODE:
C42
C4A
C4C
C4S
SYMBOL
VRRM
40
UNITS
V
IF
200
mA
IFRM
IFSM
300
mA
600
mA
PD
TJ, Tstg
250
mW
-65 to +150
°C
ΘJA
500
°C/W
ELECTRICAL
SYMBOL
IR
CHARACTERISTICS PER DIODE: (TA=25°C unless otherwise noted)
TEST CONDITIONS
MIN
TYP
MAX
VR=25V
80
500
IR
VR=25V, TA=100°C
BVR
IR=100μA
VF
IF=100μA
240
260
mV
VF
IF=500μA
285
310
mV
VF
IF=1.0mA
305
330
mV
VF
IF=50mA
535
600
mV
VF
IF=100mA
670
750
mV
CJ
VR=1.0V, f=1.0MHz
10
pF
trr
IF=IR=10mA, Irr=1.0mA, RL=100Ω
5.0
ns
25
40
100
55
UNITS
nA
μA
V
R3 (10-December 2015)
CMUSH2-4
CMUSH2-4A
CMUSH2-4C
CMUSH2-4S
SURFACE MOUNT SILICON
SCHOTTKY DIODES
SOT-523 CASE - MECHANICAL OUTLINE
(Bottom View)
PIN CONFIGURATIONS
CMUSH2-4
CMUSH2-4A
CMUSH2-4C
CMUSH2-4S
LEAD CODE:
1) Anode
2) No Connection
3) Cathode
LEAD CODE:
1) Cathode D1
2) Cathode D2
3) Anode D1, D2
LEAD CODE:
1) Anode D1
2) Anode D2
3) Cathode D1, D2
LEAD CODE:
1) Anode D1
2) Cathode D2
3) Anode D2, Cathode D1
MARKING CODE: C42
MARKING CODE:C4A
MARKING CODE: C4C
MARKING CODE: C4S
R3 (10-December 2015)
w w w. c e n t r a l s e m i . c o m
CMUSH2-4
CMUSH2-4A
CMUSH2-4C
CMUSH2-4S
SURFACE MOUNT SILICON
SCHOTTKY DIODES
TYPICAL ELECTRICAL CHARACTERISTICS
R3 (10-December 2015)
w w w. c e n t r a l s e m i . c o m
CMUSH2-4
CMUSH2-4A
CMUSH2-4C
CMUSH2-4S
SURFACE MOUNT SILICON
SCHOTTKY DIODES
TYPICAL ELECTRICAL CHARACTERISTICS
R3 (10-December 2015)
w w w. c e n t r a l s e m i . c o m
OUTSTANDING SUPPORT AND SUPERIOR SERVICES
PRODUCT SUPPORT
Central’s operations team provides the highest level of support to insure product is delivered on-time.
• Supply management (Customer portals)
• Custom bar coding for shipments
• Inventory bonding
• Custom product packing
• Consolidated shipping options
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Central’s applications engineering team is ready to discuss your design challenges. Just ask.
• Free quick ship samples (2nd day air)
• Special wafer diffusions
• Online technical data and parametric search
• PbSn plating options
• SPICE models
• Package details
• Custom electrical curves
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• Environmental regulation compliance
• Application and design sample kits
• Customer specific screening
• Custom product and package development
• Up-screening capabilities
REQUESTING PRODUCT PLATING
1. If requesting Tin/Lead plated devices, add the suffix “ TIN/LEAD” to the part number when
ordering (example: 2N2222A TIN/LEAD).
2. If requesting Lead (Pb) Free plated devices, add the suffix “ PBFREE” to the part number
when ordering (example: 2N2222A PBFREE).
CONTACT US
Corporate Headquarters & Customer Support Team
Central Semiconductor Corp.
145 Adams Avenue
Hauppauge, NY 11788 USA
Main Tel: (631) 435-1110
Main Fax: (631) 435-1824
Support Team Fax: (631) 435-3388
www.centralsemi.com
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www.centralsemi.com/wwreps
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www.centralsemi.com/wwdistributors
For the latest version of Central Semiconductor’s LIMITATIONS AND DAMAGES DISCLAIMER,
which is part of Central’s Standard Terms and Conditions of sale, visit: www.centralsemi.com/terms
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(001)
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